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See the free samples of GSA SEO Indexer GSA Indexer GSA Auto 2.99 and more. There are too many products in GSA Search Engine Ranker that you don't need.With the development of various types of electronic devices and the diversification of their functions, the number of electrical parts constituting these devices has increased. As a result, there is a growing need for resin-sealed electronic devices in which a high-frequency circuit, for example, is sealed with a resin. A high-frequency module, for example, is such a resin-sealed electronic device. The high-frequency module includes, for example, a resin package provided with a coil, and a circuit board provided with a high-frequency circuit, on which the resin package is mounted.
In the resin package, a lead frame is provided with a large number of external electrodes to which the high-frequency circuit is electrically connected. The lead frame is joined with a support portion, which is formed by potting resin with glass fibers, in order to prevent an external stress generated due to the difference in the linear thermal expansion coefficient between the resin and the support portion.
The potting resin is provided with a thermosetting property. Therefore, in the case where the support portion is used, for example, after the potting resin is cured, it is necessary to heat the potting resin to a temperature equal to or higher than a softening temperature thereof in order to depress the support portion. If the support portion is heated while the resin package is heated to a temperature equal to or higher than a melting temperature thereof in order to depress the support portion, there arises a problem in that the resin package itself may be melted due to the high temperature. 0b46394aab